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AlN components for semiconductor manufacturing equipment

Introducing AlN components with excellent corrosion resistance to fluorine-based gases, suitable for dummy wafers and targets!

At Furukawa Electric, we handle "AlN components for semiconductor manufacturing equipment." Aluminum nitride (AlN) is a well-balanced material with excellent thermal conductivity, thermal radiation (heat dissipation), thermal shock resistance, and electrical insulation properties, along with a thermal expansion that matches that of Si wafers. In addition to its excellent resistance to corrosion from fluorine-based gases, it has a low thermal expansion that matches Si, preventing deformation of the wafer due to temperature changes and reducing particle generation caused by the peeling of deposited films. 【Features】 ■ High thermal conductivity and thermal radiation rate, with excellent heat uniformity ■ Strong against thermal shock, capable of withstanding rapid heating and cooling ■ Low thermal expansion that matches Si, preventing wafer deformation due to temperature changes ■ Reduces particle generation caused by the peeling of deposited films *For more details, please refer to the PDF materials or feel free to contact us.

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